Lenovo AMD EPYC 7702P processor 2 GHz 256 MB L3 Tray

BrandLenovo
SKU / Part number02JG944
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Product overview & specifications
AMD EPYC 7702P, 2 / 3.35 GHz, 64C/128T, 256 MB L3 Cache, 200W TDP, Locked
Processor
Processor base frequency 2 GHz
Processor manufacturer AMD
Cooler included No
Thermal Design Power (TDP) 200 W
Processor cache 256 MB
Processor model 7702P
Processor threads 128
Processor operating modes 32-bit
Processor boost frequency 3.35 GHz
Component for Server/workstation
Processor lithography 7 nm
Processor family AMD EPYC
Processor cores 64
Processor socket Socket SP3
Processor cache type L3
Package type Tray
Memory
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Memory channels Octa-channel
Memory bandwidth (max) 204.8 GB/s
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Thermal Design Power (TDP) 200 W
Technical details
PCI Express slots version 4.0
Thermal Design Power (TDP) 200 W
Market segment Server
Processor cache type L3
Features
Maximum number of PCI Express lanes 128
Thermal Design Power (TDP) 200 W
PCI Express slots version 4.0
Market segment Server
Harmonized System (HS) code 85423119
Packaging data
Package type Tray
Logistics data
Harmonized System (HS) code 85423119
Lenovo AMD EPYC 7702P processor 2 GHz 256 MB L3 Tray

Lenovo AMD EPYC 7702P processor 2 GHz 256 MB L3 Tray

£5,790.53
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Lenovo AMD EPYC 7702P processor 2 GHz 256 MB L3 Tray

Lenovo AMD EPYC 7702P processor 2 GHz 256 MB L3 Tray

£5,790.53
AMD EPYC 7702P, 2 / 3.35 GHz, 64C/128T, 256 MB L3 Cache, 200W TDP, Locked
Processor
Processor base frequency 2 GHz
Processor manufacturer AMD
Cooler included No
Thermal Design Power (TDP) 200 W
Processor cache 256 MB
Processor model 7702P
Processor threads 128
Processor operating modes 32-bit
Processor boost frequency 3.35 GHz
Component for Server/workstation
Processor lithography 7 nm
Processor family AMD EPYC
Processor cores 64
Processor socket Socket SP3
Processor cache type L3
Package type Tray
Memory
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Memory channels Octa-channel
Memory bandwidth (max) 204.8 GB/s
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Thermal Design Power (TDP) 200 W
Technical details
PCI Express slots version 4.0
Thermal Design Power (TDP) 200 W
Market segment Server
Processor cache type L3
Features
Maximum number of PCI Express lanes 128
Thermal Design Power (TDP) 200 W
PCI Express slots version 4.0
Market segment Server
Harmonized System (HS) code 85423119
Packaging data
Package type Tray
Logistics data
Harmonized System (HS) code 85423119

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