Lenovo Xeon Intel Gold 5415+ processor 2.9 GHz 22.5 MB Box

BrandLenovo
SKU / Part number4XG7A83806
Need a bulk quote or product advice?
Speak to our team about your requirements.
Contact sales →
Product overview & specifications
ThinkSystem SR630 V3 Intel Xeon Gold 5415+ 8C 150W 2.9GHz Processor Option Kit w/o Fan
Processor
Processor generation Intel Xeon Scalable 4th Gen
Processor base frequency 2.9 GHz
Processor manufacturer Intel
Cooler included No
Processor codename Sapphire Rapids
Thermal Design Power (TDP) 150 W
Processor cache 22.5 MB
Processor ARK ID 232373
Processor model 5415+
Processor threads 16
System bus rate 16 GT/s
Processor boost frequency 4.1 GHz
Stepping S3
Processor family Intel® Xeon® Gold
Processor cores 8
Processor socket LGA 4677 (Socket E)
Package type Box
High priority cores 2
High priority core frequency 3.1 GHz
Low priority cores 6
Memory
Maximum internal memory supported by processor 6 TB
Memory types supported by processor DDR5-SDRAM
Supported memory types DDR5-SDRAM
Memory channels Octa-channel
ECC Yes
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Thermal Design Power (TDP) 150 W
Technical details
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Execute Disable Bit Yes
PCI Express slots version 5.0
Supported instruction sets AMX, SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Thermal Design Power (TDP) 150 W
Supported memory types DDR5-SDRAM
Status Launched
Market segment Server
Launch date Q1'23
Intel Virtualization Technology (VT-x) Yes
Number of UPI links 3
Memory speed (max) 4400 MHz
AVX-512 Fused Multiply-Add (FMA) units 2
Package carrier E1B
Features
Maximum number of PCI Express lanes 80
Thermal Design Power (TDP) 150 W
Processor package size 77.5 x 56.5 mm
Processor ARK ID 232373
Execute Disable Bit Yes
PCI Express slots version 5.0
Supported instruction sets AMX, SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Embedded options available Yes
Market segment Server
Harmonized System (HS) code 8542310001
Export Control Classification Number (ECCN) 5A992C
Commodity Classification Automated Tracking System (CCATS) G180729
Use conditions Server/Enterprise
Processor special features
Intel Software Guard Extensions (Intel SGX) Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Intel® Speed Shift Technology Yes
Intel® OS Guard Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
AVX-512 Fused Multiply-Add (FMA) units 2
Intel® Boot Guard Yes
Intel® Optane™ DC Persistent Memory Supported Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes
Mode-based Execute Control (MBE) Yes
Intel® Run Sure Technology Yes
Intel® Resource Director Technology (Intel® RDT) Yes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) Yes
Intel® Transactional Synchronization Extensions Yes
Intel® Total Memory Encryption Yes
Intel® Control-flow Enforcement Technology (CET) Yes
Maximum Enclave Size Support for Intel® SGX 128 GB
Intel® Platform Firmware Resilience Support Yes
Intel® Crypto Acceleration Yes
Intel® QuickAssist Software Acceleration Yes
Intel® On Demand Feature Activation Yes
Intel® QuickAssist Technology (QAT) 1 default devices
Intel® Dynamic Load Balancer (DLB) 1 default devices
Intel® Data Streaming Accelerator (DSA) 1 default devices
Intel® In-memory Analytics Accelerator (IAA) 1 default devices
Intel® Advanced Matrix Extensions (AMX) Yes
Operational conditions
Tcase 78 °C
DTS Max 99 °C
Packaging data
Package type Box
Logistics data
Harmonized System (HS) code 8542310001
Weight & dimensions
Processor package size 77.5 x 56.5 mm
Other features
Maximum internal memory 4 TB
Lenovo Xeon Intel Gold 5415+ processor 2.9 GHz 22.5 MB Box

Lenovo Xeon Intel Gold 5415+ processor 2.9 GHz 22.5 MB Box

£2,999.87
Skip to product information
Lenovo Xeon Intel Gold 5415+ processor 2.9 GHz 22.5 MB Box

Lenovo Xeon Intel Gold 5415+ processor 2.9 GHz 22.5 MB Box

£2,999.87
ThinkSystem SR630 V3 Intel Xeon Gold 5415+ 8C 150W 2.9GHz Processor Option Kit w/o Fan
Processor
Processor generation Intel Xeon Scalable 4th Gen
Processor base frequency 2.9 GHz
Processor manufacturer Intel
Cooler included No
Processor codename Sapphire Rapids
Thermal Design Power (TDP) 150 W
Processor cache 22.5 MB
Processor ARK ID 232373
Processor model 5415+
Processor threads 16
System bus rate 16 GT/s
Processor boost frequency 4.1 GHz
Stepping S3
Processor family Intel® Xeon® Gold
Processor cores 8
Processor socket LGA 4677 (Socket E)
Package type Box
High priority cores 2
High priority core frequency 3.1 GHz
Low priority cores 6
Memory
Maximum internal memory supported by processor 6 TB
Memory types supported by processor DDR5-SDRAM
Supported memory types DDR5-SDRAM
Memory channels Octa-channel
ECC Yes
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Thermal Design Power (TDP) 150 W
Technical details
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Execute Disable Bit Yes
PCI Express slots version 5.0
Supported instruction sets AMX, SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Thermal Design Power (TDP) 150 W
Supported memory types DDR5-SDRAM
Status Launched
Market segment Server
Launch date Q1'23
Intel Virtualization Technology (VT-x) Yes
Number of UPI links 3
Memory speed (max) 4400 MHz
AVX-512 Fused Multiply-Add (FMA) units 2
Package carrier E1B
Features
Maximum number of PCI Express lanes 80
Thermal Design Power (TDP) 150 W
Processor package size 77.5 x 56.5 mm
Processor ARK ID 232373
Execute Disable Bit Yes
PCI Express slots version 5.0
Supported instruction sets AMX, SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Embedded options available Yes
Market segment Server
Harmonized System (HS) code 8542310001
Export Control Classification Number (ECCN) 5A992C
Commodity Classification Automated Tracking System (CCATS) G180729
Use conditions Server/Enterprise
Processor special features
Intel Software Guard Extensions (Intel SGX) Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Intel® Speed Shift Technology Yes
Intel® OS Guard Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
AVX-512 Fused Multiply-Add (FMA) units 2
Intel® Boot Guard Yes
Intel® Optane™ DC Persistent Memory Supported Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes
Mode-based Execute Control (MBE) Yes
Intel® Run Sure Technology Yes
Intel® Resource Director Technology (Intel® RDT) Yes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) Yes
Intel® Transactional Synchronization Extensions Yes
Intel® Total Memory Encryption Yes
Intel® Control-flow Enforcement Technology (CET) Yes
Maximum Enclave Size Support for Intel® SGX 128 GB
Intel® Platform Firmware Resilience Support Yes
Intel® Crypto Acceleration Yes
Intel® QuickAssist Software Acceleration Yes
Intel® On Demand Feature Activation Yes
Intel® QuickAssist Technology (QAT) 1 default devices
Intel® Dynamic Load Balancer (DLB) 1 default devices
Intel® Data Streaming Accelerator (DSA) 1 default devices
Intel® In-memory Analytics Accelerator (IAA) 1 default devices
Intel® Advanced Matrix Extensions (AMX) Yes
Operational conditions
Tcase 78 °C
DTS Max 99 °C
Packaging data
Package type Box
Logistics data
Harmonized System (HS) code 8542310001
Weight & dimensions
Processor package size 77.5 x 56.5 mm
Other features
Maximum internal memory 4 TB

You may also like