Lenovo Intel Xeon Gold 5218 processor 2.3 GHz 22 MB L3 Tray
Product overview & specifications
Intel Xeon Gold 5218, 22M Cache, 2.3 GHz, 125 W TDP, FCLGA3647
Second-generation Xeon Scalable processors are limited to the amount of memory they can address, as follows:
- Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor
- Processors with an M suffix (eg 8260M): Up to 2 TB per processor
- All other processors: Up to 1 TB per processor
The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server.
For example:
- A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required
- A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required
- A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used)
- A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required
The following table lists the features of the supported second-generation Intel Xeon processors.
- Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor
- Processors with an M suffix (eg 8260M): Up to 2 TB per processor
- All other processors: Up to 1 TB per processor
The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server.
For example:
- A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required
- A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required
- A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used)
- A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required
The following table lists the features of the supported second-generation Intel Xeon processors.
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.3 GHz |
| Cooler included | No |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 22 MB |
| Processor model | 5218 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Stepping | B1 |
| Bus type | UPI |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 87 °C |
| Packaging data | |
| Package type | Tray |
Lenovo Intel Xeon Gold 5218 processor 2.3 GHz 22 MB L3 Tray
£4,342.90
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Lenovo Intel Xeon Gold 5218 processor 2.3 GHz 22 MB L3 Tray
£4,342.90
Intel Xeon Gold 5218, 22M Cache, 2.3 GHz, 125 W TDP, FCLGA3647
Second-generation Xeon Scalable processors are limited to the amount of memory they can address, as follows:
- Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor
- Processors with an M suffix (eg 8260M): Up to 2 TB per processor
- All other processors: Up to 1 TB per processor
The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server.
For example:
- A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required
- A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required
- A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used)
- A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required
The following table lists the features of the supported second-generation Intel Xeon processors.
- Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor
- Processors with an M suffix (eg 8260M): Up to 2 TB per processor
- All other processors: Up to 1 TB per processor
The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server.
For example:
- A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required
- A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required
- A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used)
- A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required
The following table lists the features of the supported second-generation Intel Xeon processors.
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.3 GHz |
| Cooler included | No |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 22 MB |
| Processor model | 5218 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Stepping | B1 |
| Bus type | UPI |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 87 °C |
| Packaging data | |
| Package type | Tray |