HP Intel Xeon 3.4GHz processor 2 MB L2
Product overview & specifications
Intel Xeon, 2M Cache, 3.4 GHz, 800 MHz
Options, accessories, services and support for all your HP and Compaq products.
| Processor | |
|---|---|
| Processor base frequency | 3.4 GHz |
| Thermal Design Power (TDP) | 110 W |
| Processor cache | 2 MB |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.25 - 1.388 V |
| Component for | Server/workstation |
| Processor lithography | 90 nm |
| Processor family | Intel® Xeon® |
| Processor front side bus | 800 MHz |
| Processor cores | 1 |
| Processor socket | Socket 604 (mPGA604) |
| Processor cache type | L2 |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 110 W |
| VID Voltage Range | 1.25 - 1.388 V |
| Technical details | |
| Number of Graphics & IMC Die Transistors | 169 M |
| Graphics & IMC Die Size | 135 mm² |
| Thermal Design Power (TDP) | 110 W |
| Market segment | Server |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 110 W |
| Number of Graphics & IMC Die Transistors | 169 M |
| Graphics & IMC Die Size | 135 mm² |
| Market segment | Server |
| Operational conditions | |
| Tcase | 72 °C |
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HP Intel Xeon 3.4GHz processor 2 MB L2
£174.24
Intel Xeon, 2M Cache, 3.4 GHz, 800 MHz
Options, accessories, services and support for all your HP and Compaq products.
| Processor | |
|---|---|
| Processor base frequency | 3.4 GHz |
| Thermal Design Power (TDP) | 110 W |
| Processor cache | 2 MB |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.25 - 1.388 V |
| Component for | Server/workstation |
| Processor lithography | 90 nm |
| Processor family | Intel® Xeon® |
| Processor front side bus | 800 MHz |
| Processor cores | 1 |
| Processor socket | Socket 604 (mPGA604) |
| Processor cache type | L2 |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 110 W |
| VID Voltage Range | 1.25 - 1.388 V |
| Technical details | |
| Number of Graphics & IMC Die Transistors | 169 M |
| Graphics & IMC Die Size | 135 mm² |
| Thermal Design Power (TDP) | 110 W |
| Market segment | Server |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 110 W |
| Number of Graphics & IMC Die Transistors | 169 M |
| Graphics & IMC Die Size | 135 mm² |
| Market segment | Server |
| Operational conditions | |
| Tcase | 72 °C |
