HP Intel Xeon L3406 processor 2.26 GHz 4 MB L3
Product overview & specifications
Intel Xeon Processor L3406 (4M Cache, 2.26 GHz)
The Intel® Xeon® processor 3000 series-based platforms unleash the computing power of Intel® Xeon® processors. Based on the next-generation Intel® microarchitecture, codenamed Nehalem, these processors provide your business with exceptional performance and power efficiency at a very affordable cost.
The Intel Xeon 3000 processor-based servers protect critical business information and offer the performance and headroom to make employees and businesses more productive, making them ideal for small and medium business owners looking for ways to support rapid business growth on small technology budgets.
Designed for needs of entry-level servers, the Intel® Xeon® processor 3400 series adapts to application behavior by automatically adjusting processing power to deliver maximum performance, protecting valuable assets from data corruption and loss, improving productivity with business growth.
DDR3 memory support up to 1333 MHz
- Supports up to thirty-two GB dual-channel DDR3 Error Correcting Code (ECC) memory which checks and corrects system memory errors;
- Flexible memory configuration options with support for up to four non-ECC or ECC unregistered DIMMs or up to six ECC Registered DIMMs.
Integrated PCI-Express 2.0 I/O
- Integrated serial I/O technology provides a direct connection between the processor and PCI Express component/adapters with bandwidth up to 8 GB/s on PCI-Express 2.0 x16 interface;
- The PCI-Express 2.0 x16 interface can be bifurcated to either two x8 PCI Express or four x4 PCI-Express interfaces for maximum design flexibility.
PCI-Express offers higher bandwidth, lower latency, and fewer I/O bottlenecks than PCI and PCI-X.
The Intel Xeon 3000 processor-based servers protect critical business information and offer the performance and headroom to make employees and businesses more productive, making them ideal for small and medium business owners looking for ways to support rapid business growth on small technology budgets.
Designed for needs of entry-level servers, the Intel® Xeon® processor 3400 series adapts to application behavior by automatically adjusting processing power to deliver maximum performance, protecting valuable assets from data corruption and loss, improving productivity with business growth.
DDR3 memory support up to 1333 MHz
- Supports up to thirty-two GB dual-channel DDR3 Error Correcting Code (ECC) memory which checks and corrects system memory errors;
- Flexible memory configuration options with support for up to four non-ECC or ECC unregistered DIMMs or up to six ECC Registered DIMMs.
Integrated PCI-Express 2.0 I/O
- Integrated serial I/O technology provides a direct connection between the processor and PCI Express component/adapters with bandwidth up to 8 GB/s on PCI-Express 2.0 x16 interface;
- The PCI-Express 2.0 x16 interface can be bifurcated to either two x8 PCI Express or four x4 PCI-Express interfaces for maximum design flexibility.
PCI-Express offers higher bandwidth, lower latency, and fewer I/O bottlenecks than PCI and PCI-X.
| Processor | |
|---|---|
| Processor base frequency | 2.26 GHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Thermal Design Power (TDP) | 30 W |
| Processor cache | 4 MB |
| Processor model | L3406 |
| Processor threads | 4 |
| System bus rate | 2.5 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.65 - 1.4 V |
| Processor boost frequency | 2.53 GHz |
| Bus type | DMI |
| Component for | Server/workstation |
| Processor lithography | 32 nm |
| Processor family | Intel® Xeon® 3000 Sequence |
| Processor cores | 2 |
| Processor socket | LGA 1156 (Socket H) |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066 MHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Memory channels | Dual-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 30 W |
| VID Voltage Range | 0.65 - 1.4 V |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 30 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 1 |
| Thermal Design Power (TDP) | 30 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Operational conditions | |
| Tcase | 53.9 °C |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
HP Intel Xeon L3406 processor 2.26 GHz 4 MB L3
£266.40
Skip to product information
HP Intel Xeon L3406 processor 2.26 GHz 4 MB L3
£266.40
Intel Xeon Processor L3406 (4M Cache, 2.26 GHz)
The Intel® Xeon® processor 3000 series-based platforms unleash the computing power of Intel® Xeon® processors. Based on the next-generation Intel® microarchitecture, codenamed Nehalem, these processors provide your business with exceptional performance and power efficiency at a very affordable cost.
The Intel Xeon 3000 processor-based servers protect critical business information and offer the performance and headroom to make employees and businesses more productive, making them ideal for small and medium business owners looking for ways to support rapid business growth on small technology budgets.
Designed for needs of entry-level servers, the Intel® Xeon® processor 3400 series adapts to application behavior by automatically adjusting processing power to deliver maximum performance, protecting valuable assets from data corruption and loss, improving productivity with business growth.
DDR3 memory support up to 1333 MHz
- Supports up to thirty-two GB dual-channel DDR3 Error Correcting Code (ECC) memory which checks and corrects system memory errors;
- Flexible memory configuration options with support for up to four non-ECC or ECC unregistered DIMMs or up to six ECC Registered DIMMs.
Integrated PCI-Express 2.0 I/O
- Integrated serial I/O technology provides a direct connection between the processor and PCI Express component/adapters with bandwidth up to 8 GB/s on PCI-Express 2.0 x16 interface;
- The PCI-Express 2.0 x16 interface can be bifurcated to either two x8 PCI Express or four x4 PCI-Express interfaces for maximum design flexibility.
PCI-Express offers higher bandwidth, lower latency, and fewer I/O bottlenecks than PCI and PCI-X.
The Intel Xeon 3000 processor-based servers protect critical business information and offer the performance and headroom to make employees and businesses more productive, making them ideal for small and medium business owners looking for ways to support rapid business growth on small technology budgets.
Designed for needs of entry-level servers, the Intel® Xeon® processor 3400 series adapts to application behavior by automatically adjusting processing power to deliver maximum performance, protecting valuable assets from data corruption and loss, improving productivity with business growth.
DDR3 memory support up to 1333 MHz
- Supports up to thirty-two GB dual-channel DDR3 Error Correcting Code (ECC) memory which checks and corrects system memory errors;
- Flexible memory configuration options with support for up to four non-ECC or ECC unregistered DIMMs or up to six ECC Registered DIMMs.
Integrated PCI-Express 2.0 I/O
- Integrated serial I/O technology provides a direct connection between the processor and PCI Express component/adapters with bandwidth up to 8 GB/s on PCI-Express 2.0 x16 interface;
- The PCI-Express 2.0 x16 interface can be bifurcated to either two x8 PCI Express or four x4 PCI-Express interfaces for maximum design flexibility.
PCI-Express offers higher bandwidth, lower latency, and fewer I/O bottlenecks than PCI and PCI-X.
| Processor | |
|---|---|
| Processor base frequency | 2.26 GHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Thermal Design Power (TDP) | 30 W |
| Processor cache | 4 MB |
| Processor model | L3406 |
| Processor threads | 4 |
| System bus rate | 2.5 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.65 - 1.4 V |
| Processor boost frequency | 2.53 GHz |
| Bus type | DMI |
| Component for | Server/workstation |
| Processor lithography | 32 nm |
| Processor family | Intel® Xeon® 3000 Sequence |
| Processor cores | 2 |
| Processor socket | LGA 1156 (Socket H) |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066 MHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Memory channels | Dual-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 30 W |
| VID Voltage Range | 0.65 - 1.4 V |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 30 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 1 |
| Thermal Design Power (TDP) | 30 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Operational conditions | |
| Tcase | 53.9 °C |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |