HP Intel Xeon 3070 processor 2.66 GHz 4 MB L2
Product overview & specifications
Intel Xeon 3070, 4M Cache, 2.66 GHz, 1066 MHz FSB
Options, accessories, services and support for all your HP and Compaq products.
| Processor | |
|---|---|
| Processor base frequency | 2.66 GHz |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 4 MB |
| Processor model | 3070 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.850 - 1.500 V |
| FSB Parity | No |
| Processor lithography | 65 nm |
| Processor family | Intel® Xeon® 3000 Sequence |
| Processor front side bus | 1066 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L2 |
| Memory | |
| ECC | No |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| VID Voltage Range | 0.850 - 1.500 V |
| Technical details | |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Physical Address Extension (PAE) | Yes |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Thermal Design Power (TDP) | 65 W |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 65 W |
| Processor package size | 37.5 mm |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Physical Address Extension (PAE) | Yes |
| Embedded options available | No |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 60.1 °C |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
HP Intel Xeon 3070 processor 2.66 GHz 4 MB L2
£430.56
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HP Intel Xeon 3070 processor 2.66 GHz 4 MB L2
£430.56
Intel Xeon 3070, 4M Cache, 2.66 GHz, 1066 MHz FSB
Options, accessories, services and support for all your HP and Compaq products.
| Processor | |
|---|---|
| Processor base frequency | 2.66 GHz |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 4 MB |
| Processor model | 3070 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.850 - 1.500 V |
| FSB Parity | No |
| Processor lithography | 65 nm |
| Processor family | Intel® Xeon® 3000 Sequence |
| Processor front side bus | 1066 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L2 |
| Memory | |
| ECC | No |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| VID Voltage Range | 0.850 - 1.500 V |
| Technical details | |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Physical Address Extension (PAE) | Yes |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Thermal Design Power (TDP) | 65 W |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 65 W |
| Processor package size | 37.5 mm |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Physical Address Extension (PAE) | Yes |
| Embedded options available | No |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 60.1 °C |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |