HP Intel Celeron G1101 processor 2.26 GHz 2 MB L3 Tray
Product overview & specifications
Intel® Celeron® Processor G1101 (2M Cache, 2.26 GHz)
Experience brilliant PC performance that lets you communicate with friends and family, enjoy entertainment, and get your work done. Get the Intel-level performance you've come to expect and quality you can count on with an Intel® Celeron® processor.
| Processor | |
|---|---|
| Processor base frequency | 2.26 GHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Thermal Design Power (TDP) | 73 W |
| Processor cache | 2 MB |
| Processor model | G1101 |
| Processor threads | 2 |
| System bus rate | 2.5 GT/s |
| Processor operating modes | 64-bit |
| Processor lithography | 32 nm |
| Processor family | Intel® Celeron® G |
| Processor cores | 2 |
| Processor socket | LGA 1156 (Socket H) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 16 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066 MHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Memory channels | Dual-channel |
| ECC | Yes |
| Graphics | |
| Number of displays supported (on-board graphics) | 2 |
| On-board graphics card base frequency | 533 MHz |
| Power | |
| Thermal Design Power (TDP) | 73 W |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel FDI Technology | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | No |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | Yes |
| Thermal Design Power (TDP) | 73 W |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 73 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | Yes |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel FDI Technology | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Packaging data | |
| Package type | Tray |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
HP Intel Celeron G1101 processor 2.26 GHz 2 MB L3 Tray
£148.50
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HP Intel Celeron G1101 processor 2.26 GHz 2 MB L3 Tray
£148.50
Intel® Celeron® Processor G1101 (2M Cache, 2.26 GHz)
Experience brilliant PC performance that lets you communicate with friends and family, enjoy entertainment, and get your work done. Get the Intel-level performance you've come to expect and quality you can count on with an Intel® Celeron® processor.
| Processor | |
|---|---|
| Processor base frequency | 2.26 GHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Thermal Design Power (TDP) | 73 W |
| Processor cache | 2 MB |
| Processor model | G1101 |
| Processor threads | 2 |
| System bus rate | 2.5 GT/s |
| Processor operating modes | 64-bit |
| Processor lithography | 32 nm |
| Processor family | Intel® Celeron® G |
| Processor cores | 2 |
| Processor socket | LGA 1156 (Socket H) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 16 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066 MHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Memory channels | Dual-channel |
| ECC | Yes |
| Graphics | |
| Number of displays supported (on-board graphics) | 2 |
| On-board graphics card base frequency | 533 MHz |
| Power | |
| Thermal Design Power (TDP) | 73 W |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel FDI Technology | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | No |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | Yes |
| Thermal Design Power (TDP) | 73 W |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 73 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | Yes |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel FDI Technology | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Packaging data | |
| Package type | Tray |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |