Lenovo Intel Xeon Gold 6226R processor 2.9 GHz 22 MB Tray

BrandLenovo
SKU / Part number4XG7A38082
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Product overview & specifications
Intel Xeon Gold 6226R, 22M Cache, 2.90 GHz, w/o Fan
Processor
Processor generation 2nd Generation Intel® Xeon® Scalable
Processor base frequency 2.9 GHz
Processor codename Cascade Lake
Thermal Design Power (TDP) 150 W
Processor cache 22 MB
Processor model 6226R
Processor threads 32
Processor operating modes 64-bit
Processor boost frequency 3.9 GHz
Number of QPI links 2
Bus type UPI
Component for Server/workstation
Processor lithography 14 nm
Processor family Intel® Xeon® Gold
Processor cores 16
Processor socket LGA 3647 (Socket P)
Package type Tray
Memory
Maximum internal memory supported by processor 1 TB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2933 MHz
Memory channels Hexa-channel
ECC Yes
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Thermal Design Power (TDP) 150 W
Technical details
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Execute Disable Bit Yes
PCI Express slots version 3.0
Supported instruction sets AVX, AVX 2.0, AVX-512, SSE4.2
Scalability 2S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Thermal Design Power (TDP) 150 W
Market segment Server
Intel Virtualization Technology (VT-x) Yes
Features
Maximum number of PCI Express lanes 48
Thermal Design Power (TDP) 150 W
Processor package size 76 x 56.5 mm
Execute Disable Bit Yes
PCI Express slots version 3.0
Supported instruction sets AVX, AVX 2.0, AVX-512, SSE4.2
Scalability 2S
Embedded options available Yes
Market segment Server
Harmonized System (HS) code 85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel Turbo Boost Max Technology 3.0 No
Intel® Speed Shift Technology Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
Intel® Volume Management Device (VMD) Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No
Intel® Optane™ DC Persistent Memory Supported Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes
Intel® vPro™ Platform Eligibility Yes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No
Operational conditions
Tcase 85 °C
Packaging data
Package type Tray
Logistics data
Harmonized System (HS) code 85423119
Weight & dimensions
Processor package size 76 x 56.5 mm
Other features
Compatibility ThinkSystem SR590/SR650
Lenovo Intel Xeon Gold 6226R processor 2.9 GHz 22 MB Tray

Lenovo Intel Xeon Gold 6226R processor 2.9 GHz 22 MB Tray

£4,149.94
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Lenovo Intel Xeon Gold 6226R processor 2.9 GHz 22 MB Tray

Lenovo Intel Xeon Gold 6226R processor 2.9 GHz 22 MB Tray

£4,149.94
Intel Xeon Gold 6226R, 22M Cache, 2.90 GHz, w/o Fan
Processor
Processor generation 2nd Generation Intel® Xeon® Scalable
Processor base frequency 2.9 GHz
Processor codename Cascade Lake
Thermal Design Power (TDP) 150 W
Processor cache 22 MB
Processor model 6226R
Processor threads 32
Processor operating modes 64-bit
Processor boost frequency 3.9 GHz
Number of QPI links 2
Bus type UPI
Component for Server/workstation
Processor lithography 14 nm
Processor family Intel® Xeon® Gold
Processor cores 16
Processor socket LGA 3647 (Socket P)
Package type Tray
Memory
Maximum internal memory supported by processor 1 TB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2933 MHz
Memory channels Hexa-channel
ECC Yes
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Thermal Design Power (TDP) 150 W
Technical details
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Execute Disable Bit Yes
PCI Express slots version 3.0
Supported instruction sets AVX, AVX 2.0, AVX-512, SSE4.2
Scalability 2S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Thermal Design Power (TDP) 150 W
Market segment Server
Intel Virtualization Technology (VT-x) Yes
Features
Maximum number of PCI Express lanes 48
Thermal Design Power (TDP) 150 W
Processor package size 76 x 56.5 mm
Execute Disable Bit Yes
PCI Express slots version 3.0
Supported instruction sets AVX, AVX 2.0, AVX-512, SSE4.2
Scalability 2S
Embedded options available Yes
Market segment Server
Harmonized System (HS) code 85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel Turbo Boost Max Technology 3.0 No
Intel® Speed Shift Technology Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
Intel® Volume Management Device (VMD) Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No
Intel® Optane™ DC Persistent Memory Supported Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes
Intel® vPro™ Platform Eligibility Yes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No
Operational conditions
Tcase 85 °C
Packaging data
Package type Tray
Logistics data
Harmonized System (HS) code 85423119
Weight & dimensions
Processor package size 76 x 56.5 mm
Other features
Compatibility ThinkSystem SR590/SR650

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