Lenovo Intel Xeon Gold 6128 processor 3.4 GHz 19.25 MB L3

BrandLenovo
SKU / Part number7XG7A05588
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Product overview & specifications
Intel Xeon Gold 6128 6C 115W 3.4GHz ThinkSystem SR650 Processor option kit
With two processors installed, the two processors are connected together using one UPI link. With four processors installed, the processors are connected together using a ring topology, using two UPI links, one to each adjacent processor in the ring.

Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.
Processor
Processor generation 1st Generation Intel® Xeon® Scalable
Processor base frequency 3.4 GHz
Cooler included Yes
Processor codename Skylake
Thermal Design Power (TDP) 115 W
Processor cache 19.25 MB
Processor model 6128
Processor threads 12
Processor operating modes 64-bit
Processor boost frequency 3.7 GHz
Stepping H0
Component for Server/workstation
Processor lithography 14 nm
Processor family Intel® Xeon® Gold
Processor cores 6
Processor socket LGA 3647 (Socket P)
Processor cache type L3
Memory
Maximum internal memory supported by processor 768 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2666 MHz
Memory channels Hexa-channel
ECC Yes
Graphics
On-board graphics card No
Power
Thermal Design Power (TDP) 115 W
Technical details
Intel TSX-NI Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Execute Disable Bit Yes
Enhanced Intel SpeedStep Technology Yes
PCI Express slots version 3.0
Scalability S4S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available No
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Thermal Design Power (TDP) 115 W
Market segment Server
Intel Virtualization Technology (VT-x) Yes
Processor cache type L3
Features
Maximum number of PCI Express lanes 48
Thermal Design Power (TDP) 115 W
Execute Disable Bit Yes
PCI Express slots version 3.0
Scalability S4S
Embedded options available No
Market segment Server
Harmonized System (HS) code 85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Conflict-Free processor Yes
Intel Turbo Boost Max Technology 3.0 No
Intel® Speed Shift Technology Yes
Intel® Optane™ Memory Ready No
Intel TSX-NI Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Enhanced Intel SpeedStep Technology Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
Intel® vPro™ Platform Eligibility Yes
Operational conditions
Tcase 74 °C
Logistics data
Harmonized System (HS) code 85423119
Lenovo Intel Xeon Gold 6128 processor 3.4 GHz 19.25 MB L3

Lenovo Intel Xeon Gold 6128 processor 3.4 GHz 19.25 MB L3

£3,137.42
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Lenovo Intel Xeon Gold 6128 processor 3.4 GHz 19.25 MB L3

Lenovo Intel Xeon Gold 6128 processor 3.4 GHz 19.25 MB L3

£3,137.42
Intel Xeon Gold 6128 6C 115W 3.4GHz ThinkSystem SR650 Processor option kit
With two processors installed, the two processors are connected together using one UPI link. With four processors installed, the processors are connected together using a ring topology, using two UPI links, one to each adjacent processor in the ring.

Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.
Processor
Processor generation 1st Generation Intel® Xeon® Scalable
Processor base frequency 3.4 GHz
Cooler included Yes
Processor codename Skylake
Thermal Design Power (TDP) 115 W
Processor cache 19.25 MB
Processor model 6128
Processor threads 12
Processor operating modes 64-bit
Processor boost frequency 3.7 GHz
Stepping H0
Component for Server/workstation
Processor lithography 14 nm
Processor family Intel® Xeon® Gold
Processor cores 6
Processor socket LGA 3647 (Socket P)
Processor cache type L3
Memory
Maximum internal memory supported by processor 768 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2666 MHz
Memory channels Hexa-channel
ECC Yes
Graphics
On-board graphics card No
Power
Thermal Design Power (TDP) 115 W
Technical details
Intel TSX-NI Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Execute Disable Bit Yes
Enhanced Intel SpeedStep Technology Yes
PCI Express slots version 3.0
Scalability S4S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available No
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Thermal Design Power (TDP) 115 W
Market segment Server
Intel Virtualization Technology (VT-x) Yes
Processor cache type L3
Features
Maximum number of PCI Express lanes 48
Thermal Design Power (TDP) 115 W
Execute Disable Bit Yes
PCI Express slots version 3.0
Scalability S4S
Embedded options available No
Market segment Server
Harmonized System (HS) code 85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Conflict-Free processor Yes
Intel Turbo Boost Max Technology 3.0 No
Intel® Speed Shift Technology Yes
Intel® Optane™ Memory Ready No
Intel TSX-NI Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Enhanced Intel SpeedStep Technology Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
Intel® vPro™ Platform Eligibility Yes
Operational conditions
Tcase 74 °C
Logistics data
Harmonized System (HS) code 85423119

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