DELL Intel Xeon 3.0 GHz processor 3 GHz 2 MB L2 Tray

BrandDELL
SKU / Part numberK9469
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Product overview & specifications
Intel Xeon 3.0 GHz, 2 MB Cache, 800 MHz FSB
Hyper-Threading Technology (HT Technology)
Today's Intel Hyper-Threading Technology (Intel® HT Technology) delivers thread-level parallelism on each processor resulting in more efficient use of processor resources—higher processing throughput—and improved performance on the multi-threaded software of today and tomorrow.
Processor
Processor base frequency 3 GHz
Thermal Design Power (TDP) 55 W
Processor cache 2 MB
Processor threads 2
Processor operating modes 64-bit
VID Voltage Range 1.05 - 1.20 V
CPU multiplier (bus/core ratio) 15
Component for Server/workstation
Processor lithography 90 nm
Processor family Intel® Xeon®
Processor front side bus 800 MHz
Processor cores 1
Processor socket Socket 604 (mPGA604)
Processor cache type L2
Package type Tray
Power
Thermal Design Power (TDP) 55 W
VID Voltage Range 1.05 - 1.20 V
Features
Thermal Design Power (TDP) 55 W
Market segment Server
Technical details
Thermal Design Power (TDP) 55 W
Market segment Server
Processor cache type L2
Packaging data
Package type Tray
DELL Intel Xeon 3.0 GHz processor 3 GHz 2 MB L2 Tray

DELL Intel Xeon 3.0 GHz processor 3 GHz 2 MB L2 Tray

£834.62
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DELL Intel Xeon 3.0 GHz processor 3 GHz 2 MB L2 Tray

DELL Intel Xeon 3.0 GHz processor 3 GHz 2 MB L2 Tray

£834.62
Intel Xeon 3.0 GHz, 2 MB Cache, 800 MHz FSB
Hyper-Threading Technology (HT Technology)
Today's Intel Hyper-Threading Technology (Intel® HT Technology) delivers thread-level parallelism on each processor resulting in more efficient use of processor resources—higher processing throughput—and improved performance on the multi-threaded software of today and tomorrow.
Processor
Processor base frequency 3 GHz
Thermal Design Power (TDP) 55 W
Processor cache 2 MB
Processor threads 2
Processor operating modes 64-bit
VID Voltage Range 1.05 - 1.20 V
CPU multiplier (bus/core ratio) 15
Component for Server/workstation
Processor lithography 90 nm
Processor family Intel® Xeon®
Processor front side bus 800 MHz
Processor cores 1
Processor socket Socket 604 (mPGA604)
Processor cache type L2
Package type Tray
Power
Thermal Design Power (TDP) 55 W
VID Voltage Range 1.05 - 1.20 V
Features
Thermal Design Power (TDP) 55 W
Market segment Server
Technical details
Thermal Design Power (TDP) 55 W
Market segment Server
Processor cache type L2
Packaging data
Package type Tray

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