HP Intel Pentium D 840 processor 3.2 GHz 2 MB L3
Product overview & specifications
Intel Pentium D 840, 2M Cache, 3.20 GHz, 800 MHz FSB
Options, accessories, services and support for all your HP and Compaq products.
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 2 MB |
| Processor model | 840 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.200 - 1.400 V |
| FSB Parity | No |
| Processor lithography | 90 nm |
| Processor family | Intel® Celeron® D |
| Processor front side bus | 800 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L3 |
| Memory | |
| ECC | No |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| VID Voltage Range | 1.200 - 1.400 V |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | No |
| Number of Processing Die Transistors | 230 M |
| Processing Die size | 206 mm² |
| Physical Address Extension (PAE) | Yes |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Thermal Design Power (TDP) | 130 W |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 130 W |
| Processor package size | 37.5 mm |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 230 M |
| Processing Die size | 206 mm² |
| Physical Address Extension (PAE) | Yes |
| Embedded options available | No |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | No |
| Intel Demand Based Switching | No |
| Operational conditions | |
| Tcase | 69.8 °C |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | No |
HP Intel Pentium D 840 processor 3.2 GHz 2 MB L3
£158.40
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HP Intel Pentium D 840 processor 3.2 GHz 2 MB L3
£158.40
Intel Pentium D 840, 2M Cache, 3.20 GHz, 800 MHz FSB
Options, accessories, services and support for all your HP and Compaq products.
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 2 MB |
| Processor model | 840 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.200 - 1.400 V |
| FSB Parity | No |
| Processor lithography | 90 nm |
| Processor family | Intel® Celeron® D |
| Processor front side bus | 800 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L3 |
| Memory | |
| ECC | No |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| VID Voltage Range | 1.200 - 1.400 V |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | No |
| Number of Processing Die Transistors | 230 M |
| Processing Die size | 206 mm² |
| Physical Address Extension (PAE) | Yes |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Thermal Design Power (TDP) | 130 W |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 130 W |
| Processor package size | 37.5 mm |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 230 M |
| Processing Die size | 206 mm² |
| Physical Address Extension (PAE) | Yes |
| Embedded options available | No |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | No |
| Intel Demand Based Switching | No |
| Operational conditions | |
| Tcase | 69.8 °C |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | No |