XPG Lancer Blade memory module 32 GB 2 x 16 GB DDR5 6400 MT/s 288-pin DIMM ECC
Product overview & specifications
32 GB(16 x 2), DDR5, 6400 MT/s, CL 32, XMP 3.0, AMD EXPO, ECC, White
LANCER BLADE DDR5
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
| Memory | |
|---|---|
| Package type | Blister |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Features | |
| On-Die ECC | Yes |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Weight & dimensions | |
| Package width | 141 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Width | 133.3 mm |
| Depth | 33.8 mm |
| Height | 7.8 mm |
| Weight | 36.2 g |
| Package type | Blister |
| Package weight | 113 g |
| Packaging data | |
| Package width | 141 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Package type | Blister |
| Package weight | 113 g |
XPG Lancer Blade memory module 32 GB 2 x 16 GB DDR5 6400 MT/s 288-pin DIMM ECC
£557.33
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XPG Lancer Blade memory module 32 GB 2 x 16 GB DDR5 6400 MT/s 288-pin DIMM ECC
£557.33
32 GB(16 x 2), DDR5, 6400 MT/s, CL 32, XMP 3.0, AMD EXPO, ECC, White
LANCER BLADE DDR5
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
| Memory | |
|---|---|
| Package type | Blister |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Features | |
| On-Die ECC | Yes |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Weight & dimensions | |
| Package width | 141 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Width | 133.3 mm |
| Depth | 33.8 mm |
| Height | 7.8 mm |
| Weight | 36.2 g |
| Package type | Blister |
| Package weight | 113 g |
| Packaging data | |
| Package width | 141 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Package type | Blister |
| Package weight | 113 g |