HP Elite SFF 805 G9 AMD RyzenT 5 8500G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro
HP Elite SFF 805 G9 AMD RyzenT 5 8500G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro

HP Elite SFF 805 G9 AMD Ryzen™ 5 8500G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro

BrandHP
SKU / Part numberA55R0ET#ABU
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Product overview & specifications

Elite SFF 805 G9 Desktop PC, Windows 11 Pro, AMD Ryzen 5, 16GB RAM, 512GB SSD

Power your most demanding applications
Step into the future with the highly secure and easy to manage HP Elite 805 SFF equipped with an AMD Ryzen 8000 series processor[2] and AMD RDNA 3 onboard graphics, and an NPU[3] that work together to balance workloads get the most out of cloud-based AI applications. Quickly work through multiple tasks with AI-enhanced power that takes over mundane tasks for you so you can focus on what matters most.

Specifications

Processor
Processor generation AMD Ryzen 8000 Series
Processor cache type L3
Processor cache 16 MB
Processor frequency 3.7 GHz
Processor model 8500G
Processor manufacturer AMD
Processor boost frequency 5 GHz
Processor threads 12
Processor cores 6
Processor family AMD RyzenT 5
Memory
Memory layout (slots x size) 1 x 16 GB
Internal memory 16 GB
Maximum internal memory 16 GB
Memory slots 4x DIMM
Internal memory type DDR5-SDRAM
Memory clock speed 5600 MHz
Memory module type UDIMM
Storage
Storage media SSD
Number of storage drives installed 1
SSD interface PCI Express
SSD capacity 512 GB
Number of SSDs installed 1
Total storage capacity 512 GB
SSD form factor M.2
Total SSDs capacity 512 GB
NVMe Yes
Graphics
On-board graphics card family AMD Radeon Graphics
On-board graphics card Yes
On-board graphics card model AMD Radeon 740M
On-board GPU manufacturer AMD
Performance
Password protection Yes
Password protection type BIOS, Power on
Motherboard chipset AMD PRO 665
Audio chip Realtek ALC3252
Harmonized System (HS) code 8471500000
Network
Ethernet LAN Yes
Wi-Fi Yes
Bluetooth Yes
Bluetooth version 5.3
Wi-Fi standards Wi-Fi 6 (802.11ax)
Ethernet LAN data rates 10,100,1000 Mbit/s
Cabling technology 10/100/1000Base-T(X)
WLAN controller model Realtek RTL8852BE
Top Wi-Fi standard Wi-Fi 6 (802.11ax)
Antenna type 2x2
WLAN controller manufacturer Realtek
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity 4
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity 1
HDMI version 2.1
USB 2.0 ports quantity 4
Line-in Yes
HDMI ports quantity 1
Expansion slots
PCI Express x1 (Gen 3.x) slots 1
Number of 3.5" bays 1
PCI Express x16 (Gen 4.x) slots 1
Power
Power supply 260 W
Technical details
Chassis type SFF
Number of 3.5" bays 1
Motherboard chipset AMD PRO 665
UNSPSC-code 43211507
Memory module type UDIMM
Sustainable technologies and materials At least 40% post-consumer recycled plastic; At least 10% ITE-derived closed loop plastic; Ocean-bound plastic in speaker enclosure and I/O strip; Molded paper pulp cushion inside box is made of 100% recycled or certified sources; Low halogen; Bulk packaging available; 80 Plus Platinum power supplies available; Outside box and corrugated cushions are made of 100% recycled or certified sources
Sustainability compliance Yes
Sustainability certificates TCO
General Product Safety Regulation (GPSR) URL https://support.hp.com/us-en/document/ish_6126692-6126777-16?openCLC=true
HP GTIN (EAN/UPC) 199485302218
Design
Chassis type SFF
Number of 3.5" bays 1
Country of origin Czech Republic
Introduction year 2025
Software
Pre-installed software HP Easy Clean
Operating system installed Windows 11 Pro
Brand-specific features
HP Security tools Microsoft 3rd Party UEFI CA Enable
HP Management tools HP Image Assistant (download)
HP segment Business
HP GTIN (EAN/UPC) 199485302218
Audio
Audio chip Realtek ALC3252
Operational conditions
Operating relative humidity (H-H) 10 - 90%
Operating temperature (T-T) 10 - 35 �C
Sustainability
Total carbon footprint (kg of CO2e) 190.028
Sustainable technologies and materials At least 40% post-consumer recycled plastic; At least 10% ITE-derived closed loop plastic; Ocean-bound plastic in speaker enclosure and I/O strip; Molded paper pulp cushion inside box is made of 100% recycled or certified sources; Low halogen; Bulk packaging available; 80 Plus Platinum power supplies available; Outside box and corrugated cushions are made of 100% recycled or certified sources
Sustainability compliance Yes
Sustainability certificates TCO
Weight & dimensions
Package width 399 mm
Package depth 499 mm
Package height 228 mm
Width 338 mm
Depth 308 mm
Height 338 mm
Package weight 7.72 kg
Weight 5.4 kg
Packaging data
Package width 399 mm
Package depth 499 mm
Package height 228 mm
Package weight 7.72 kg
Packaging content
Numeric keypad No
Keyboard included Yes
Input device model HP 125 Wired Mouse
Keyboard connectivity Wired
Keyboard
Keyboard connectivity Wired
Logistics data
Harmonized System (HS) code 8471500000
Supplier features
Manufacturer warranty 1 year (1/1/1) limited warranty includes 1 year of parts, labor and on-site repair. Terms and conditions vary by country. Certain restrictions and exclusions apply.
Carbon footprint
Total carbon footprint (kg of CO2e) 190.028
Total carbon emissions, w/o use phase (kg of CO2e) 32.453
Carbon emissions, manufacturing (kg of CO2e) 154.462
Carbon emissions, logistics (kg of CO2e) 1.765
Carbon emissions, end-of-life (kg of CO2e) 1.348
Features
Country of origin Czech Republic
Other features
On-board graphics card Yes
Processor manufacturer AMD
UNSPSC-code 43211507
Memory module type UDIMM
Country of origin Czech Republic
Harmonized System (HS) code 8471500000
Manufacturer warranty 1 year (1/1/1) limited warranty includes 1 year of parts, labor and on-site repair. Terms and conditions vary by country. Certain restrictions and exclusions apply.
HP Elite SFF 805 G9 AMD RyzenT 5 8500G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro

HP Elite SFF 805 G9 AMD Ryzen™ 5 8500G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro

£1,340.69
Skip to product information
HP Elite SFF 805 G9 AMD RyzenT 5 8500G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro

HP Elite SFF 805 G9 AMD Ryzen™ 5 8500G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro

£1,340.69

Elite SFF 805 G9 Desktop PC, Windows 11 Pro, AMD Ryzen 5, 16GB RAM, 512GB SSD

Power your most demanding applications
Step into the future with the highly secure and easy to manage HP Elite 805 SFF equipped with an AMD Ryzen 8000 series processor[2] and AMD RDNA 3 onboard graphics, and an NPU[3] that work together to balance workloads get the most out of cloud-based AI applications. Quickly work through multiple tasks with AI-enhanced power that takes over mundane tasks for you so you can focus on what matters most.

Specifications

Processor
Processor generation AMD Ryzen 8000 Series
Processor cache type L3
Processor cache 16 MB
Processor frequency 3.7 GHz
Processor model 8500G
Processor manufacturer AMD
Processor boost frequency 5 GHz
Processor threads 12
Processor cores 6
Processor family AMD RyzenT 5
Memory
Memory layout (slots x size) 1 x 16 GB
Internal memory 16 GB
Maximum internal memory 16 GB
Memory slots 4x DIMM
Internal memory type DDR5-SDRAM
Memory clock speed 5600 MHz
Memory module type UDIMM
Storage
Storage media SSD
Number of storage drives installed 1
SSD interface PCI Express
SSD capacity 512 GB
Number of SSDs installed 1
Total storage capacity 512 GB
SSD form factor M.2
Total SSDs capacity 512 GB
NVMe Yes
Graphics
On-board graphics card family AMD Radeon Graphics
On-board graphics card Yes
On-board graphics card model AMD Radeon 740M
On-board GPU manufacturer AMD
Performance
Password protection Yes
Password protection type BIOS, Power on
Motherboard chipset AMD PRO 665
Audio chip Realtek ALC3252
Harmonized System (HS) code 8471500000
Network
Ethernet LAN Yes
Wi-Fi Yes
Bluetooth Yes
Bluetooth version 5.3
Wi-Fi standards Wi-Fi 6 (802.11ax)
Ethernet LAN data rates 10,100,1000 Mbit/s
Cabling technology 10/100/1000Base-T(X)
WLAN controller model Realtek RTL8852BE
Top Wi-Fi standard Wi-Fi 6 (802.11ax)
Antenna type 2x2
WLAN controller manufacturer Realtek
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity 4
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity 1
HDMI version 2.1
USB 2.0 ports quantity 4
Line-in Yes
HDMI ports quantity 1
Expansion slots
PCI Express x1 (Gen 3.x) slots 1
Number of 3.5" bays 1
PCI Express x16 (Gen 4.x) slots 1
Power
Power supply 260 W
Technical details
Chassis type SFF
Number of 3.5" bays 1
Motherboard chipset AMD PRO 665
UNSPSC-code 43211507
Memory module type UDIMM
Sustainable technologies and materials At least 40% post-consumer recycled plastic; At least 10% ITE-derived closed loop plastic; Ocean-bound plastic in speaker enclosure and I/O strip; Molded paper pulp cushion inside box is made of 100% recycled or certified sources; Low halogen; Bulk packaging available; 80 Plus Platinum power supplies available; Outside box and corrugated cushions are made of 100% recycled or certified sources
Sustainability compliance Yes
Sustainability certificates TCO
General Product Safety Regulation (GPSR) URL https://support.hp.com/us-en/document/ish_6126692-6126777-16?openCLC=true
HP GTIN (EAN/UPC) 199485302218
Design
Chassis type SFF
Number of 3.5" bays 1
Country of origin Czech Republic
Introduction year 2025
Software
Pre-installed software HP Easy Clean
Operating system installed Windows 11 Pro
Brand-specific features
HP Security tools Microsoft 3rd Party UEFI CA Enable
HP Management tools HP Image Assistant (download)
HP segment Business
HP GTIN (EAN/UPC) 199485302218
Audio
Audio chip Realtek ALC3252
Operational conditions
Operating relative humidity (H-H) 10 - 90%
Operating temperature (T-T) 10 - 35 �C
Sustainability
Total carbon footprint (kg of CO2e) 190.028
Sustainable technologies and materials At least 40% post-consumer recycled plastic; At least 10% ITE-derived closed loop plastic; Ocean-bound plastic in speaker enclosure and I/O strip; Molded paper pulp cushion inside box is made of 100% recycled or certified sources; Low halogen; Bulk packaging available; 80 Plus Platinum power supplies available; Outside box and corrugated cushions are made of 100% recycled or certified sources
Sustainability compliance Yes
Sustainability certificates TCO
Weight & dimensions
Package width 399 mm
Package depth 499 mm
Package height 228 mm
Width 338 mm
Depth 308 mm
Height 338 mm
Package weight 7.72 kg
Weight 5.4 kg
Packaging data
Package width 399 mm
Package depth 499 mm
Package height 228 mm
Package weight 7.72 kg
Packaging content
Numeric keypad No
Keyboard included Yes
Input device model HP 125 Wired Mouse
Keyboard connectivity Wired
Keyboard
Keyboard connectivity Wired
Logistics data
Harmonized System (HS) code 8471500000
Supplier features
Manufacturer warranty 1 year (1/1/1) limited warranty includes 1 year of parts, labor and on-site repair. Terms and conditions vary by country. Certain restrictions and exclusions apply.
Carbon footprint
Total carbon footprint (kg of CO2e) 190.028
Total carbon emissions, w/o use phase (kg of CO2e) 32.453
Carbon emissions, manufacturing (kg of CO2e) 154.462
Carbon emissions, logistics (kg of CO2e) 1.765
Carbon emissions, end-of-life (kg of CO2e) 1.348
Features
Country of origin Czech Republic
Other features
On-board graphics card Yes
Processor manufacturer AMD
UNSPSC-code 43211507
Memory module type UDIMM
Country of origin Czech Republic
Harmonized System (HS) code 8471500000
Manufacturer warranty 1 year (1/1/1) limited warranty includes 1 year of parts, labor and on-site repair. Terms and conditions vary by country. Certain restrictions and exclusions apply.

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